MANILA, Philippines (Feb. 2025) — MediaTek has introduced three new power-efficient chipsets, the Dimensity 7400, Dimensity 7400X, and Dimensity 6400, aiming to bring enhanced gaming, AI performance, and 5G connectivity to a wider range of smartphones. These latest additions complement the flagship Dimensity 9400 and premium Dimensity 8400, ensuring a full spectrum of mobile SoCs for high-end and mainstream devices.
The Dimensity 7400 and 7400X integrate an octa-core CPU featuring four Arm Cortex-A78 cores clocked at up to 2.6GHz and four Arm Cortex-A55 cores running at 2.0GHz, along with an Arm Mali-G615 MC2 GPU. Built on TSMC’s 4nm process, the chipsets claim a power efficiency improvement of up to 36% over competing models during gaming. Equipped with MediaTek Advanced Gaming Technology (MAGT) 3.0, they optimize game settings dynamically, reduce input lag, and extend battery life for longer play sessions.
“With our Dimensity 7400 and Dimensity 6400 chipsets, MediaTek is once again proving that premium smartphone experiences can be accessible to more consumers,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business. “From AI applications to photography and gaming, users can expect significant performance boosts and power efficiency improvements.”
The Dimensity 7400 and 7400X also integrate MediaTek’s NPU 6.0, offering a 15% AI performance improvement over its predecessor, the Dimensity 7300. The Imagiq 950 ISP supports advanced AI-driven photography enhancements, while Google Ultra HDR ensures high dynamic range and richer colors in photos and videos. The Dimensity 7400X specifically supports dual-display flip phones, offering greater design flexibility for OEMs. Connectivity features include a 5G R16 modem with 3CC carrier aggregation and MediaTek’s UltraSave 3.0+ technology, providing up to 20% lower power consumption. Tri-band Wi-Fi 6E ensures reliable, multi-gigabit wireless performance.
The Dimensity 6400, part of the more budget-friendly 6000 series, delivers improved 5G connectivity and power efficiency. Featuring an octa-core CPU with two Arm Cortex-A76 cores at 2.5GHz and six Arm Cortex-A55 cores at 2.0GHz, it uses TSMC’s 6nm process to reduce power consumption by up to 19% compared to competitors. The chipset enhances gaming with MediaTek Bluetooth Wi-Fi HyperCoex technology, cutting latency by up to 90%, while its Release 16 Sub-6 5G modem enables faster downlink and uplink speeds. The Dimensity 6400 also supports 10-bit billion-color displays and advanced camera processing, including 108MP sensors with multi-frame noise reduction.
The first smartphones powered by the Dimensity 7400 and 7400X are set to launch in Q1 2025, while devices featuring the Dimensity 6400 are already available. More details about MediaTek’s Dimensity portfolio can be found at MediaTek’s official site.
