TAIWAN (Mar 2025) — MediaTek has unveiled the Dimensity 8350, a high-performance 5G chipset designed to elevate everyday smartphone experiences, from gaming to AI-driven creativity. Built on advanced 4nm technology, the processor delivers faster speeds, improved power efficiency, and smooth gameplay with MediaTek HyperEngine.
The Dimensity 8350 features an Armv9 octa-core CPU, including four Cortex-A715 processors clocked at up to 3.35GHz. Combined with flagship-level memory and storage speeds, it ensures seamless performance across apps, games, and entertainment.
Enhanced Gaming with MediaTek HyperEngine
Optimized for mobile gaming, the chipset’s HyperEngine Adaptive Gaming Technology dynamically adjusts CPU, GPU, and network resources. This enables stable frame rates, lower latency, and reduced power consumption, ensuring longer playtime with minimal interruptions.
Generative AI and Imaging Upgrades
Equipped with a Generative AI-ready NPU, the Dimensity 8350 supports AI-powered features such as voice call summarization, offline translation, and intelligent photo organization. For imaging, the MediaTek Imagiq 980 ISP enables 4K60 HDR video recording with improved power efficiency and superior image clarity.
Smarter Display and Connectivity
The MediaTek MiraVision 880 enhances video streaming by applying real-time AI adjustments for better contrast, sharpness, and color accuracy. On the connectivity front, Wi-Fi 6E with a 2T2R antenna setup ensures faster and more reliable connections. The integrated 5G modem offers multi-gigabit speeds and improved range, while MediaTek’s Wi-Fi/Bluetooth hybrid coexistence technology ensures seamless operation between wireless devices.
Built for Customization
Through the Dimensity 5G Open Resource Architecture, smartphone manufacturers can tailor features across the camera, NPU, display, and connectivity, enabling device makers to create differentiated experiences.
The MediaTek Dimensity 8350 is set to power the next generation of smartphones, delivering enhanced performance, intelligent AI capabilities, and ultra-fast connectivity.
