BARCELONA, Spain (Feb 2025) — MediaTek is pushing the boundaries of connectivity and AI at Mobile World Congress 2025, showcasing next-generation technologies designed to shape the future of wireless communication. The company is highlighting its latest advancements, including hybrid computing for 6G, a live demonstration of non-terrestrial network (NTN) broadband over Low Earth Orbit (LEO) satellites, and the M90 5G-Advanced modem.
At its booth in Hall 3, MediaTek is also unveiling new developments in Dimensity Auto and Dimensity smartphone SoCs, alongside some of the latest MediaTek-powered devices from leading global brands.
Pioneering 6G with Hybrid Computing
MediaTek is demonstrating its Hybrid Computing system, which integrates cloud and radio access network (RAN) to form an “edge cloud.” This approach extends computing power beyond devices, reducing latency for generative AI, enhancing data privacy, and optimizing resource management. The implementation is showcased in partnership with NVIDIA, Intel, and G REIGNS.
To maximize 6G spectrum efficiency, MediaTek is also presenting Sub-Band Full Duplex (SBFD) technology, which enhances uplink coverage and reduces latency in unpaired spectrum. The company, in collaboration with Keysight, has successfully mitigated self-interference in SBFD—an issue particularly challenging for compact devices like smartphones.
M90 5G Advanced Modem: Faster, Smarter, and More Efficient
The new M90 5G-Advanced modem promises speeds of up to 12Gbps with support for 3GPP Release 17 and upcoming Release 18 specifications. It enables simultaneous FR1+FR2 connectivity and features Smart AI Antenna technology, which uses AI-driven scenario identification to optimize data throughput.
The M90 modem also integrates MediaTek UltraSave, which cuts average power consumption by 18% compared to its predecessor. During MWC 2025, MediaTek is demonstrating a 10Gbps throughput using an M90-powered device on a live Ericsson network.
The modem’s Smart AI Antenna feature detects how a user holds their device and adjusts signal transmission accordingly—without the need for external sensors. This innovation, showcased in partnership with Anritsu, helps maintain strong and stable connections in various real-world conditions.
Expanding Generative AI Beyond Smartphones
MediaTek is introducing its Generative AI Gateway, a system that extends AI capabilities to all connected devices in a home or enterprise network. By decentralizing AI processing, the gateway enhances device performance without compromising privacy or security.
The company is also displaying cutting-edge customer premises equipment (CPE), which includes three-transmission antenna (3TX) technology for a 1.9x boost in uplink performance and Low-Latency, Low-Loss, and Scalable throughput (L4S) for a 20x reduction in network latency.
Leading the Future of Satellite Connectivity
MediaTek continues its leadership in 5G-Advanced Non-Terrestrial Network (NTN) technology, unveiling advancements in Ku-band NR-NTN for next-generation satellite connectivity. The company recently completed a successful field trial using OneWeb’s LEO satellites, Eutelsat infrastructure, and Airbus in-orbit systems.
This milestone paves the way for broader satellite-based 5G coverage, ensuring seamless connectivity in remote and underserved areas.
Dimensity Auto and Dimensity 9400: Smarter Cars, More Powerful Smartphones
In the automotive space, MediaTek’s Dimensity Auto platform is on display, showcasing next-gen in-vehicle experiences with high-end multimedia, 3D graphics, and AI processing. The platform’s eCockpit system features an 8K display and runs on a hypervisor, allowing seamless multitasking across virtual machines.
Meanwhile, flagship smartphones powered by the Dimensity 9400 chipset are also being demonstrated, featuring advanced generative AI, AI-powered photography enhancements, and ray-traced graphics for gaming.
Pushing the Limits of AI and Computing
MediaTek is also unveiling its 224G SerDes technology, designed to meet the demands of AI, hyperscale computing, and data center applications. This solution optimizes performance, power efficiency, and bandwidth density, enabling cutting-edge AI acceleration and next-gen interconnect solutions.
The company is already working on future SerDes iterations in collaboration with major foundries, focusing on chip-to-chip interconnects and ultra-large package designs.
For more updates, visit the MediaTek booth at MWC 2025 (#3D10).
